ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE
Incazelo emfushane:
I-MoreLink's SA120IE iyimojula ye-DOCSIS 3.0 ECMM (Imojuli Yemodemu Yekhebula Eshumekiwe) esekela amashaneli ahlanganisiwe afinyelela kwangu-8 awela phansi nomfula angu-4 ukuze ilethe ulwazi lwe-inthanethi lwesivinini esikhulu.
I-SA120IE izinga lokushisa liqiniswe ukuze lihlanganiswe kweminye imikhiqizo edingekayo ukuze isebenze ngaphandle noma endaweni yokushisa eyedlulele.
Imininingwane Yomkhiqizo
Omaka bomkhiqizo
Imininingwane Yomkhiqizo
I-MoreLink's SA120IE iyimojula ye-DOCSIS 3.0 ECMM (Imojuli Yemodemu Yekhebula Eshumekiwe) esekela amashaneli ahlanganisiwe afinyelela kwangu-8 awela phansi nomfula angu-4 ukuze ilethe ulwazi lwe-inthanethi lwesivinini esikhulu.
I-SA120IE izinga lokushisa liqiniswe ukuze lihlanganiswe kweminye imikhiqizo edingekayo ukuze isebenze ngaphandle noma endaweni yokushisa eyedlulele.
Ngokusekelwe kumsebenzi we-Full Band Capture (FBC), i-SA120IE akuyona nje iModemu Yekhebula, kodwa futhi ingasetshenziswa njenge-Spectrum Analyzer.
Lokhu kucaciswa komkhiqizo kuhlanganisa izinguqulo ze-DOCSIS® kanye ne-EuroDOCSIS® 3.0 zochungechunge lweModuli Yekhebula Eshumekiwe yeModemu yemikhiqizo.Ngokuphuma kwalo mbhalo, uzobizwa nge-SA120IE.I-SA120IE izinga lokushisa liqiniswe ukuze lihlanganiswe kweminye imikhiqizo edingekayo ukuze isebenze ngaphandle noma endaweni yokushisa eyedlulele.Ngokusekelwe kumsebenzi we-Full Band Capture (FBC), i-SA120IE akuyona nje iModemu Yekhebula, kodwa futhi ingasetshenziswa njenge-Spectrum Analyzer (SSA-Splendidtel Spectrum Analyzer).I-Heatsink iyimpoqo futhi iqondene nohlelo lokusebenza.Kuhlinzekwa izimbobo ezintathu ze-PCB ezizungeze i-CPU, ukuze ubakaki oshisayo noma idivayisi efanayo inamathiselwe ku-PCB, ukudlulisa ukushisa okukhiqiziwe kude ne-CPU futhi kuya endaweni yokuhlala nendawo.
Izici Zomkhiqizo
➢ I-DOCSIS / EuroDOCSIS 3.0 iyahambisana
➢ Amashaneli angu-8 angaphansi komfula x 4 ahlanganiswe phezulu nomfula
➢ Sekela Ukuthwebula Kwebhendi Egcwele
➢ Izixhumi ezimbili ze-MCX (Owesifazane) ze-Downstream kanye ne-Upstream
➢ Izimbobo ze-Ethernet ezingu-10/100/1000 Mbps ezimbili
➢ I-Standalone External Watchdog
➢ Inzwa yokushisa ebhodini
➢ Ileveli yamandla e-RF enembile (+/-2dB) kulo lonke izinga lokushisa
➢ I-Spectrum Analyzer Eshumekiwe (Ibanga: 5~1002 MHz)
➢ DOCSIS MIBs, SCTE HMS MIBs asekelwe
➢ Ukuthuthukiswa kwesofthiwe ngenethiwekhi ye-HFC
➢ Sekela i-SNMP V1/V2/V3
➢ Sekela ukubethelwa kobumfihlo okuyisisekelo (BPI/BPI+)
➢ Usayizi omncane (ubukhulu): 136mm x 54mm
Isicelo
➢ Transponder: Fiber Node, UPS, Power Supply.
Imingcele Yezobuchwepheshe
| Ukusekelwa Kwephrothokholi | ||
| I-DOCSIS/EuroDOCSIS 1.1/2.0/3.0 I-SNMP v1/v2/v3 TR069 | ||
| Ukuxhumana | ||
| RF: MCX1, MCX2 | Ama-MCX Amabili, 75 OHM, I-Engle Eqondile, i-DIP | |
| I-Ethernet Signal/PWR: J1, J2 | 1.27mm 2x17 PCB Stack, I-engeli eqondile, i-SMD 2xGiga Ethernet Izimbobo | |
| I-RF Downstream | ||
| Imvamisa (umphetho-kuya-onqenqemeni) | 88~1002 MHz (DOCSIS) 108~1002 MHz (EuroDOCSIS) | |
| Umkhawulokudonsa wesiteshi | 6 MHz (DOCSIS) 8 MHz (EuroDOCSIS) 6/8 MHz (Ukutholwa okuzenzakalelayo, Imodi yeHybrid) | |
| Ukushintshashintsha kwezwi | 64QAM, 256QAM | |
| Isilinganiso Sedatha | Kufika ku-400 Mbps nge-8 Channel bonding | |
| Ileveli Yesiginali | Idokhumenti: -15 kuya ku-+15 dBmV I-Euro Docsis: -17 kuya ku-+13 dBmV (64QAM);-13 kuya +17 dBmV (256QAM) | |
| I-RF ekhuphukayo | ||
| I-Frequency Range | 5~42 MHz (DOCSIS) 5~65 MHz (EuroDOCSIS) 5~85 MHz (Uma uthanda) | |
| Ukushintshashintsha kwezwi | I-TDMA: QPSK, 8QAM, 16QAM, 32QAM, 64QAM I-S-CDMA: QPSK, 8QAM, 16QAM, 32QAM, 64QAM, 128QAM | |
| Isilinganiso Sedatha | Kufika ku-108 Mbps nge-4 Channel Bonding | |
| I-RF Output Level | I-TDMA (32/64 QAM): +17 ~ +57 dBmV I-TDMA (8/16 QAM): +17 ~ +58 dBmV I-TDMA (QPSK): +17 ~ +61 dBmV I-S-CDMA: +17 ~ +56 dBmV | |
| Inethiwekhi | ||
| Iphrothokholi yenethiwekhi | IP/TCP/UDP/ARP/ICMP/DHCP/TFTP/SNMP/HTTP/TR069/VPN (L2 kanye ne-L3) | |
| Umzila | Iseva ye-DNS / DHCP / RIP I no-II | |
| Ukwabelana nge-inthanethi | Iseva ye-NAT / NAPT / DHCP / DNS | |
| Inguqulo ye-SNMP | I-SNMP v1/v2/v3 | |
| Iseva ye-DHCP | Iseva ye-DHCP eyakhelwe ngaphakathi ukuze isabalalise ikheli le-IP ku-CPE ngembobo ye-CM ye-Ethernet | |
| DCHP iklayenti | I-CM ithola ngokuzenzakalelayo ikheli leseva ye-IP ne-DNS kusuka kuseva ye-MSO DHCP | |
| Omakhenikha | ||
| Ubukhulu | 56mm (W) x 113mm (L) | |
| Ezemvelo | ||
| Okokufaka kwamandla | Sekela okokufaka kwamandla okubanzi: +12V ukuya ku-+24V DC | |
| Ukusetshenziswa kwamandla | 12W (Ubukhulu) I-7W (TPY.) | |
| Izinga Lokushisa Lokusebenza | Ezentengiso: 0 ~ +70oC Izimboni: -40 ~ +85oC | |
| Umswakama Osebenzayo | 10~90% (Akufinyeleli) | |
| Izinga Lokushisa Lesitoreji | -40 ~ +85oC | |
Izixhumi zebhodi ukuya kubhodi phakathi kweDigital kanye nebhodi le-CM
Kunamabhodi amabili: I-Digital board kanye ne-CM Board, asebenzisa amapheya amane ezixhumi zebhodi ukuya ebhodini ukuze adlulisele amasignali e-RF, amasignali eDijithali namandla.
Amapheya amabili ezixhumi ze-MCX ezisetshenziselwa i-DOCSIS Downstream kanye ne-Upstream RF Signals.Amapheya amabili e-Pin Header/PCB Socket asetshenziselwa Amasignali Adijithali namandla.Ibhodi le-CM libekwe ngaphansi kweDigital Board.I-CM's CPU ithintwa endlini ngephedi ye-thermal ukuze kudluliswe ukushisa kude ne-CPU futhi kuya endaweni yokuhlala nendawo.
Ukuphakama okuhlanganisiwe phakathi kwamabhodi amabili kungu-11.4+/-0.1mm.
Nawu umfanekiso wokuxhumanisa ibhodi nebhodi okufanayo:
Qaphela:
Imbangela yokwakhiwa kweBhodi-kuya-Ibhodi kwamabhodi amabili e-PCBA, ukuze kuqinisekiswe ukuxhumana okuzinzile nokuthembekile, ngakho-ke, lapho
Ukuklama Izindlu, kufanele kucatshangelwe ubunjiniyela bomhlangano nezikulufu ukuze kucatshangelwe.
J1, J2: 2.0mm 2x7 PCB Isokhethi, I-engeli eqondile,I-SMD
I-J1: Incazelo Yephini (Okokuqala)
| J1 iphini | Ibhodi le-CM | Ibhodi Ledijithali | Amazwana |
| 1 | GND | ||
| 2 | GND | ||
| 3 | I-TR1+ | Izimpawu ze-Giga Ethernet ezivela ebhodini le-CM. AKUKHO isiguquli se-Ethernet ebhodini le-CM, nazi Kuphela I-Ethernet MDI Signals to Digital Board.I-RJ45 kanye ne-Ethernet transformer zibekwe ku-Digital Board. | |
| 4 | TR1- | ||
| 5 | I-TR2+ | ||
| 6 | TR2- | ||
| 7 | I-TR3+ | ||
| 8 | TR3- | ||
| 9 | I-TR4+ | ||
| 10 | TR4- | ||
| 11 | GND | ||
| 12 | GND | ||
| 13 | GND | Ibhodi ledijithali linikeza Amandla ebhodini le-CM, ububanzi bezinga lamandla;+12 ukuze +24V DC | |
| 14 | GND |
I-J2: Incazelo Yephini (Okokuqala)
| J2 iphini | Ibhodi le-CM | Ibhodi Ledijithali | Amazwana |
| 1 | GND | ||
| 2 | Setha kabusha | Ibhodi ledijithali lingathumela isignali yokusetha kabusha ebhodini le-CM, bese usetha kabusha i-CM.0 ~ 3.3VDC | |
| 3 | GPIO_01 | 0 ~ 3.3VDC | |
| 4 | GPIO_02 | 0 ~ 3.3VDC | |
| 5 | UART Vumela | 0 ~ 3.3VDC | |
| 6 | I-UART Transmit | 0 ~ 3.3VDC | |
| 7 | UART Thola | 0 ~ 3.3VDC | |
| 8 | GND | ||
| 9 | GND | 0 ~ 3.3VDC | |
| 10 | SPI MOSI | 0 ~ 3.3VDC | |
| 11 | IWASHI LE-SPI | 0 ~ 3.3VDC | |
| 12 | SPI MISO | 0 ~ 3.3VDC | |
| 13 | I-SPI Chip Khetha 1 | 0 ~ 3.3VDC | |
| 14 | GND |
Phina Ukumatanisa Unhlokweni ne-J1, J2: 2.0mm 2x7, Isihloko Sokuphina, I-engeli eqondile,I-SMD
PCB Dimension
